Specifikáció:
Mfr Package Description:27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
REACH Compliant: Yes
Status: Discontinued
Microprocessor/Microcontroller/Peripheral IC Type: MICROCONTROLLER, RISC
ADC Channels: NO
Address Bus Width: 24
Bit Size: 32
Clock Frequency-Max: 20 MHz
DAC Channels: NO
DMA Channels: NO
External Data Bus Width: 32
JESD-30 Code: S-PBGA-B388
JESD-609 Code: e0
Moisture Sensitivity Level: 3
Number of I/O Lines: 16
Number of Terminals: 388
Operating Temperature-Min: -40 Cel
Operating Temperature-Max: 125 Cel
Package Body Material: PLASTIC/EPOXY
Package Code: BGA
Package Equivalence Code: BGA388,26X26,40
Package Shape: SQUARE
Package Style: GRID ARRAY
Peak Reflow Temperature (Cel): 240
Power Supplies: 2.6,5
PWM Channels: NO
Qualification Status: COMMERCIAL
RAM (bytes): 32768
ROM Programmability: FLASH
ROM (words): 0
Seated Height-Max: 2.55 mm
Speed: 56 MHz
Sub Category: Microcontrollers
Supply Voltage-Nom: 2.6 V
Supply Voltage-Min: 2.5 V
Supply Voltage-Max: 2.7 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: AUTOMOTIVE
Terminal Finish: TIN LEAD
Terminal Form: BALL
Terminal Pitch: 1 mm
Terminal Position: BOTTOM
Time@Peak Reflow Temperature-Max (s): 30
Length: 27 mm
Width: 27 mm
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